AWB04 Wafer Bonder
Features
- Unique in ways such as in-situ alignment system (X,Y,Z & θ)
- 1-5 micron alignment accuracy depending on options & wafers
- automatic PC control & data acquisition
- application of high voltage up to 2.5KV
- temperatures up to 560 degrees C
- forces up to 25,000N
- self-contained dry pumping system for cacuum up to up to 10-6 mBar range
- forced nitrogen cooling
- 3"-6"wafers.